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Handset motherboard
- 01: Plates: 6 storeys
- 02: Surface treatment: sink gold +OSP
- 03: Finished product thickness: 1.0mm
- 04: Outer linewidth: 0.12mm
- 05: Outer line spacing: 0.08mm
- 06: Minimum diameter hole: 0.20mm
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Product Description
WiFi wireless communication motherboard
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